Keyword [Nanoporous copper] Result: 1 - 3 | Page: 1 of 1 1.  Research On Low Temperature Thermo-compression Bonding Technology Using Nanoporous Copper As Bonding Layer 2.  A Study Of The Preparation And Properties Of High-temperature Joint With Porous Copper As Interlayer 3.  Fundamental Research On Nano Thermocompression Bonding Technology   <<First  <Prev  Next>  Last>>  Jump to

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