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Keyword [Nanoindentation]
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1. Experimental Research And Reliability Analysis On Lead-free Solder Joints In Microelectronic Packaging
2. Effects Of Impurities On The Mechanical Properties Of Czochralski Silicon
3. Fused Quartz Uv Laser Initial Damage Morphology Studies
4. Study On Cu - Wire Bonding Materials And Their Process Characteristics In IC Package
5. The Research On FE Simulation And Experiment Of Nanoindentation For The Crystal Characteristics Of Monocrystal Silicon
6. Effect Of Rapid Thermal Processing On Mechanical Properties Of Silicon
7. Research On The Mechanical Properties Of Intermeallic Compound And Analysis Of Solder Joint Reliability In Electronic Packaging
8. Theanalysis Of TSV-Cu’s Properties Based On Nanoindentation And Finite Element Simulation
9. Research On The Indentation Strain Rate Sensitivity Of Lead-free Solders And Thermal Fatigue Reliability Of PBGA Solder Joint
10. Periodic Nanoindentation Patterns Fabricated On AlGaInP Leds And Their Effects On Light Extraction
11. Study On High-temperature Mechanical Properties And Interconnect Reliability Of Lead-free Alloy
12. Study On The Modulation Of Semiconductor Properties Based On Laser Irradiation And Plastic Promotion
13. Research On The Micro-scale Mechanical Properties Of Lead-free Solder Joint In Electronic Packaging
14. Strain Mechanism And Stress Models Of Wafer-level Strained SOI
15. Electron Microscopy Study Of Deformation In Al-Based Complex Metallic Alloy Phases
16. Experimental Research Of Indentation Testing Of GaAs Material
17. Research On The Nanomechanical Properties And Fixed Abrasive Lapping Experiment Of ?-Ga2O3
18. Inhomogeneity And Anisotropic Study On Microscale Mechanical Behavior Of Lead-Free Solders In Electronic Packaging
19. Development and validation of a novel data analysis procedure for spherical nanoindentation
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