Font Size: a A A
Keyword [Metallization]
Result: 1 - 20 | Page: 1 of 4
1. Theoretical And Experimental Study On Ohmic Contacts To Silicon Carbide
2. Ic Cu Interconnect Process Of Ta-based Diffusion Barrier Layer Research
3. A Study On The CMP Of Coper For Mulilevel Metallization In ULSI
4. Fabrication Of Optical Fiber Probes And Eletodes Based On Self-Assembled Techniques
5. Investigation Of Electromigration On Lead-Free Solder Bump In Flip Chip Packaging
6. Research Of Electroless Nickel Plating On The Surface Of Quartz Optic Fiber Grating And The Sensing Characters
7. DNA Metallization And Its Electric Characteristic Research
8. Study On Diamond/Copper Composites Fabricated By Surface Metallization-Chemical Co-Deposition Method In Electronic Packaging Application
9. Research On Characteristic Of MOCVD Barrier TiN Film
10. Study On Tantalumnitride Diffusion Barrier Of Copper Metallization
11. Research On Fabrication Process Of High Power LED
12. Electromigration Behavior Of Ni/Sn-3.0Ag-0.5Cu/ENEPIG(OSP) Solder Joints In Flip Chip Packaging
13. Flexible Multi-layer Circuit Board Hole Metallization Technology
14. Flexible Hdi Boards Key Technologies
15. For 45nm Copper Interconnect And Copper Contact Technology, Ultra-thin Diffusion Barrier Layer Research
16. Based On The Straight-line Method Of Finite Conductivity With The Thickness Of The Microstrip Line Performance Analysis And Software Implementation
17. Based On The Back Of The Power Transistor Metallization Sputtering Process Design
18. The Back Of The Power Transistor Metallization And Optimization Design
19. Study Of Sputtering Metallization Of BaTiO3-based PTC Ceramic
20. A Study Of Features Of Optical Fiber Gratings Metallized With Nickel
  <<First  <Prev  Next>  Last>>  Jump to