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Keyword [MEMS packaging]
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1. Research On MEMS Packaging By Induction Heating And Its Applications
2. Research On Some Basic Issues Of MEMS Packaging Based On Process Mechanics
3. Radio Frequency Characteristics Of Ka Band Distributed MEMS Transmission Line Phase Shifter On Silicon Substrate
4. Localized Induction Heating Packaging And Its Applications
5. The Residual Stress In The Evolution Of Mems Package And Its Associated Reliability
6. Research On Induction Local Heating For MEMS Packaging
7. Research On Induction Local Heating For Mems Packaging
8. Research On Reactive Bonding Technology And Application
9. Research On Back-end Processes For Uncooled Infrared Detectors
10. Indium Flip-Chip Packaging For X-ray Detector
11. Study Of Silicon Deep Reactive Ion Etching Process For MEMS Packaging
12. Research On Glass Reflow Preparation And Design Of Glass Substrate Embedded With Passives
13. Fabrication and testing of micro vias in liquid crystal polymer (LCP) substrate for RF-MEMS packaging applications
14. Polymer-based wafer-level packaging of micromachined HARPSS devices
15. MEMS packaging: Fluxless soldering and reliability assessment
16. CVD polycrystalline diamond (poly-C) thin film technology for MEMS packaging
17. Micromachined infrared sensors with device-level encapsulation
18. Thin Film Encapsulation Methods for Large Area MEMS Packaging
19. Low Profile Packaging for MEMS Aero-acoustic Sensors
20. Qualification of metallized optical fiber connections for chip-level MEMS packaging
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