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Keyword [Lead-free Solder]
Result: 41 - 60 | Page: 3 of 4
41. Study Of Electromigration In Lead-free Solder Joints On Electroless Ni-P Substrate
42. Study On The Reliability Of Military Electronic Modules’ Lead-free Solder Joint
43. Reliability Investigation Of Lead-free Micro-electronic Packaging Solder Joint Under Electromigration
44. Research Of Damage Characteristics About Lead-free Solder Joints Based On Impedance Method
45. Research On Software Test Module Of Lead-free Solder Paste Printed Equipment
46. Interfacial Reaction Between Cu Substrate And Lead-free Solders Under Miniaturization Trend
47. Soldering Reliability Study And Solder Material Selection Analysis In BGA Package
48. Research And Development Of A Soldering Flux For Lead-free Solder Wires In Al Soldering Process Of Electronic Packaging
49. Research On The Frequency Characteristic Of Lead-free Solder Joint Damage Under Stretch And Impact By Lab VIEW
50. Effects Of Mn Doping On Interfacial Reaction And Mechanical Properties Of Sn-0.3Ag-0.7Cu Lead-free Solder
51. Numerical Simulation And Experimental Study On Shear Of SnAgCu Lead-free Solder Joints
52. Research On The Indentation Strain Rate Sensitivity Of Lead-free Solders And Thermal Fatigue Reliability Of PBGA Solder Joint
53. Lead-free Solder Joint Electromigration Induced Interface Compound Growth And Failure Research
54. Study On High-temperature Mechanical Properties And Interconnect Reliability Of Lead-free Alloy
55. Research On Creep Behavior Of Flip-chip Sn-3Ag-0.5Cu Solder Under Large Current Action
56. Research On Creep Behavior Of Lead-free Solder Joint Under Thermomigration
57. Research On The Micro-scale Mechanical Properties Of Lead-free Solder Joint In Electronic Packaging
58. Creep And Thermomechanical Fatigue Behaviors Of Lead-free Solder Joint Under High Current Density
59. Numerical Simulation Of Dynamic Fracture Behavior On Lead-free Solder
60. Research Of Magnetic Field Effects On Microstructures And Mechanical Properties Of Lead-free Solder Joints
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