Keyword [Johnson-Cook model] Result: 1 - 3 | Page: 1 of 1 1.  Experimental Research And Reliability Analysis On Lead-free Solder Joints In Microelectronic Packaging 2.  Investigation Of Mechanical Behaviors Of Solder Joints Under Drop Impact Loading 3.  Numerical Simulation Of Dynamic Fracture Behavior On Lead-free Solder   <<First  <Prev  Next>  Last>>  Jump to

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