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Keyword [Isothermal aging]
Result: 1 - 8 | Page: 1 of 1
1.
Study Of Isothermal Aging And Electromigration Behaviors And The Size Effect Of Lead-free Solder Mirco-interconnections In Electronic Packages
2.
Study Of Microstructural Evolution Of Narrow Gap Cu/Sn-Cu-Ni-xRE/Cu Solder Joints And The Size Effect On Their Mechanical Properties
3.
Research On Single Sn Crystal Micron Bump For The3D-TSV Packaging
4.
Experimental Investigation Of The Mechanical Behavior Of IMC In Solder Joints Under Various Strain Rates
5.
Research On The Preparation And Performances Of Cu-pillar Bumps With Sn Cap In The Area Array Packaging
6.
Research On Creep Behavior Of Lead-free Solder Joint Under Thermomigration
7.
Effect Of Thermomigration On Microstructure And Mechanical Properties Of Lead-free Micro Solder Joint
8.
The Reliability Of BGA Packaging Under Board-Level Based On Shear Mechanical Behavior
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