Font Size: a A A
Keyword [Intermetallic compound]
Result: 1 - 20 | Page: 1 of 2
1. Study On Size Effect Of Induction Heatng And Characteristics Of Induction Heatng Interconnection Technology For BGA Packaging
2. Data Mining Technology In The Metallurgical, Chemical Applications
3. Effects Of Electromigration On Cross-solder Interaction And Interfacial Reaction In Lead-free Solder Joints
4. Investigation Of Electromigration On Lead-Free Solder Bump In Flip Chip Packaging
5. Evaluation Of Bondability And Reliability Of Single Crystal Copper Wire Bonding In Semiconductor Packaging
6. Electromigration Behavior Of Ni/Sn-3.0Ag-0.5Cu/ENEPIG(OSP) Solder Joints In Flip Chip Packaging
7. Solder Volume Effects On The Formation And Evolution Of Microstructure And Shear Fracture Behavior Of BGA Structure Cu(Ni)/Sn3.0Ag0.5Cu/Ni(Cu) Interconnects
8. The Interfacial Reaction Of Solder Joint For Flip Chip Assembly With Cu/OSP Pad And Its Reliability
9. Study Of Microstructural Evolution Of Narrow Gap Cu/Sn-Cu-Ni-xRE/Cu Solder Joints And The Size Effect On Their Mechanical Properties
10. Interfacial Reaction Between Cu Substrate And Lead-free Solders Under Miniaturization Trend
11. Research On The Mechanical Properties Of Intermeallic Compound And Analysis Of Solder Joint Reliability In Electronic Packaging
12. Microstructure Of Lead-free And Tin-lead Mixed Solder Bump Research
13. Study On Liquid-solid Electromigration Behavior In Ni/Sn-9Zn/Ni And Cu/Sn-58Bi/Ni Interconnects
14. Properties And Behaviors Of Cu-Al Intermetallic Compounds On Copper Wire Bonding In IC Packaging
15. Reseach On The Correlation Of Wire Bonding And Intermetallic Compound
16. Investigation On Ultrasonic Ball Bonding And Reliability Of Integrated Circuit Packaging With Copper Wire
17. Research On The Preparation And Performances Of Cu-pillar Bumps With Sn Cap In The Area Array Packaging
18. Study On The Interconnection Mechanism Of TLP Bonding Process In Cu/Sn/Ni System
19. Influence Of TiO2 Nanoparticles Addition And Joint Size On Interfacial Reaction Of Lead-free Microscale Solder Joints
20. Research On The Micro-scale Mechanical Properties Of Lead-free Solder Joint In Electronic Packaging
  <<First  <Prev  Next>  Last>>  Jump to