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Keyword [Intermetallic Compounds]
Result: 1 - 16 | Page: 1 of 1
1. Interfacial Reaction And Reliability In Lead-free Electronics Packaging
2. On-Line Measurement Of Cu Fab Deformability In Thermosonic Wire Bonding And Interfacial Reaction Study Of Cu/Al
3. Research On The Thermal Fatigue Reliability And Interfacial Reactions Of Plastic Ball Grid Solder Joints
4. Investigation On The Relationship Between The Microstructure Evolution Of The Intermetallic Compounds In Solder Joints And The Micro-and Macro-mechanical Behavior
5. Preparation And Characterization Of ZnCdO Films And Lnvestigation Of Al-Os Alloy By First Principles Calculations
6. Properties And Behaviors Of Cu-Al Intermetallic Compounds On Copper Wire Bonding In IC Packaging
7. First-principle Studies On The Structures And Properties Of Several Chalcogenide Compounds Under High Pressure
8. Influence Of Palladium Addition On The Reliability Of Copper Wire Bonding
9. The Creep Behaviors Of Lead-free Micro-solder Joints And The Growth Mechanism Of Tin Whisker On Coatings In Electronic Packaging
10. Effects Of Nano-CeO2 Addition On Interfacial IMC Growth Of Sn-0.3Ag-0.7Cu-xCeO2/Cu Solder Joints
11. Effects Of Electrothermal Coupling On The Growth Of Intermetallic Compounds Of Copper Pillar Bump
12. Growth Behavior And Mechanism Of Intermetallic Compounds In Co-P/Solder Interface Under Temperature Gradient
13. Study On Surface Modification And Metal Finishing Of Printed Circuit Substrate
14. Fabrication And Microstructure Research Of Full IMCs Micro-joint With The Aid Of Thermal Gradient
15. Study On The Formation Of Sidewall Intermetallic Compounds In Micron-Level Copper Pillar Bumps
16. Research On Interface Behavior Of Sn/Ni System With Micro-Interconnect Structure
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