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Keyword [Interfacial reaction]
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1. Study Of Active Bonding Mechanism Between Sn3.5Ag4Ti(Ce,Ga) And Non-metallic Substrates At Low Temperature
2. Epitaxial Growth Of Composition Well-controlled AlGaN On Al Substrate By Pulsed Laser Depostion
3. Interfacial Reaction And Reliability In Lead-free Electronics Packaging
4. On-Line Measurement Of Cu Fab Deformability In Thermosonic Wire Bonding And Interfacial Reaction Study Of Cu/Al
5. Research On The Interfacial Reaction And Mechanical Property Of Solder Joints With Micron Stand-Off Height
6. Effects Of Electromigration On Cross-solder Interaction And Interfacial Reaction In Lead-free Solder Joints
7. Early Stage Interfacial Reaction And Undercooling Solidification Behavior Of Microscale Lead-free Solder Interconnects During Reflowing Process
8. Interfacial Issues Of Lead-free Interconnection And RFID Fabrication
9. Sequentially Electroplated SN-AG Alloy Bump Fabrication And Technology Optimization
10. The Interfacial Reaction Of Solder Joint For Flip Chip Assembly With Cu/OSP Pad And Its Reliability
11. Simulation Of Electromigration And Size Effect On Interfacial Reaction In Lead-free Solder Joints
12. Study On Dissolution Of Substrate In Lead-free Solder Joints Upon Electron Current Stressing
13. Study On Reverse Polarity Effect In Sn-9Zn Interconnect During Liquid-solid Electromigration
14. Interfacial Reaction Between Cu Substrate And Lead-free Solders Under Miniaturization Trend
15. Effects Of Mn Doping On Interfacial Reaction And Mechanical Properties Of Sn-0.3Ag-0.7Cu Lead-free Solder
16. Study On Liquid-solid Electromigration Behavior In Ni/Sn-9Zn/Ni And Cu/Sn-58Bi/Ni Interconnects
17. An Experimental Study On The Microfluidics-Based Adsorption-Dialysis Membrane
18. Influence Of Joint Size And TiO2 Nanoparticles Dopant On Interfacial Reaction Of Micro-solder Joints
19. Influence Of TiO2 Nanoparticles Addition And Joint Size On Interfacial Reaction Of Lead-free Microscale Solder Joints
20. Formation And Interfacial Reaction Of Stud Bump/Sn-based Solder Joint
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