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Keyword [Interface IMC]
Result: 1 - 4 | Page: 1 of 1
1.
Research On Joint Shear Properties And Interface Structure Of BGA Solder
2.
Research On Creep Behavior Of Lead-free Solder Joint Under Thermomigration
3.
Research And Numerical Simulation On Creep Properties Of Lead Free Micro-joints Under Thermomigration
4.
Study Of IMC Growth And Control At Interface Of Micro Copper Pillar Bumps For High Density Package
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