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Keyword [Flip-chip Package]
Result: 1 - 11 | Page: 1 of 1
1.
Investigation On Viscoelastic Characteristics Of Micro-Electronic Flip-Chip Packages
2.
Research On Packaging Technology Innovation Of Mobile Device Processing Chip Based On Copper Clad Laminated Flip Chip Technology
3.
Research On Stress Monitoring Technology In Flip Chip Package
4.
Research On Impact Of Solder Joint IMC Reliability In3D IC Package
5.
Research On Reliability For Flip-chip Package And Through Silicon Via (TSV) In3D Package
6.
Research On The Reliability Of Electromigration In Solder Bump Of Flip Chip Packaging Under Multi-physics Coupling
7.
Electrical Characteristics Of Flip-Chip Package Interconnection
8.
Signal Integrity Analysis Of High Speed Flip Chip Package Interconnection
9.
Reliability Research On Technology-Service Process Of Flip Chip Package Components
10.
Assessment of the mechanical integrity of copper/low-k dielectric in a flip chip package
11.
Research On Electro-migration Failure Of Flip Chip Under Electro-thermal-Structure Coupling
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