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Keyword [Flip chip interconnect]
Result: 1 - 4 | Page: 1 of 1
1.
Electrical Characteristics Of Flip-Chip Package Interconnection
2.
A systems approach to ultra-fine pitch flip chip interconnect packaging
3.
Silver flip chip interconnect technology and solid state bonding
4.
Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology
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