Electronics packaging - Globe Thesis

Keyword [Electronics packaging] Result: 1 - 16 \| Page: 1 of 1
1.	Research On Mechanical Properties Of Typical Heterogeneous Materials Based On Asymptotic Homogenization Method
2.	Interfacial Reaction And Reliability In Lead-free Electronics Packaging
3.	Thermal Performance Research On Electronics Packaging Component Based On Flip Bonding
4.	A Study On Interface Failure Analysis And Reliability For High Temperature Electronic Packaging
5.	Research On The Process And Reliability Of RFID Tag Packaged By ACA
6.	The Affect Of Hygrothermal Aging To The Mechanical Properties Of Polyurethane Elastomer In Toughening Electronics Packaging Material
7.	Effects Of Moisture On Delamination Failure Of Microelectronics Package During Solder Reflow
8.	Mechanism And Experiment Study On Piezoelectric-gas Hybrid Driving Jet Dispensing
9.	Investigation On Fatigue Behavior Of Sintered Nanosilver For High Density Electronics Packaging
10.	Simulation And Experimental Research Of Needle-typed Micro Jet Dispenser Driven By Piezoelectric Actuator
11.	High Temperature Electronics Packaging Processes and Materials Development
12.	Three-dimensional electronics packaging integration of stereolithography and direct print
13.	Evaluation of various die-attachment materials and processes for power electronics packaging
14.	Damage mechanics of Electromigration and Thermomigration in electronics packaging solder joints under time varying current loading
15.	Conformal electronics packaging through additive manufacturing and micro-dispensing
16.	Design and analyses of a dimple array interconnect technique for power electronics packaging
<<First <Prev Next> Last>> Jump to