Keyword [DBC substrate] Result: 1 - 2 | Page: 1 of 1 1.  A Study On Interface Failure Analysis And Reliability For High Temperature Electronic Packaging 2.  Research On The Thermal Stress Field And Fatigue Life Of Power Chip/DBC Substrate Bonding Structure Based On The Self-propagating Foil   <<First  <Prev  Next>  Last>>  Jump to

Globe Thesis Copyright © 2023. All Rights Reserved. | Privacy | Copyright | Contribute | About | Contact | RSS