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Keyword [BGA packaging]
Result: 1 - 6 | Page: 1 of 1
1.
Study On Size Effect Of Induction Heatng And Characteristics Of Induction Heatng Interconnection Technology For BGA Packaging
2.
Analysis On Thermal Stress And Thermal Reliability Of BGA Packaging
3.
Simulation And Experimental Verification On The Reliability Of BGA Packaging
4.
The Reliability Of BGA Packaging Under Board-Level Based On Shear Mechanical Behavior
5.
Signal Integrity Analysis Of The Die-PCB Interconnect Structure
6.
Solder Ball Defect Detection Of BGA Chip Based On Machine Vision
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