3D Packaging - Globe Thesis

Keyword [3D Packaging] Result: 1 - 20 \| Page: 1 of 1
1.	The Study Of The Material Function In 3D Packaging CAD System
2.	Study And Realization Geometric Modeling Of 3D Packaging CAD System
3.	Study On Process And Reliability Of High Power LED Packaging And Through Silicon Via3D Packaging By Simulation And Experiment
4.	Analysis Of Thermo-mechanical Stress In3-D Package With Through-Silicon Via
5.	Research On Single Sn Crystal Micron Bump For The3D-TSV Packaging
6.	Design And Research Of Three Dimensional Wire Bonding System For MEMS Sensor
7.	Finite Element Analysis On Reliability Of Vertical Interconnection Of 3D Packaging Power Module
8.	Study On The Process And Reliability Of 3D Packaging
9.	Thermal Performance Research Of 3D High Power Chips On The Basis Of TSV
10.	Fabrication And Characterization Of Cu-Sn-Ni-Cu Interconnection Microstructures For 3D Integration
11.	Design And Realization Of Ku-band Transceiver Frequency Conversion Module Based On 3D Vertical Interconnection Packaging Technology
12.	Electrodeposition Preparation Method And Mechanism Of Nano-copper Pillar Array Substrate For 3D Packaging
13.	Thermodynamics Research Of TSV Based Three-dimensional Chip
14.	Study Of Ceramic Interposer Key Technology
15.	A Novel TSV Structure And Numerical Simulation Of Thermos-Stress For 3D Package
16.	Research On High-frequency Electromagnetic Characteristics Of New TSV Structure
17.	Thermo-mechanical analysis of a three-dimensional package in microelectronics and cooling technologies for an IGBT thermal tester in power electronics
18.	Assembly process development for fine pitch (0.4 mm) package-on-package devices in a lead-free assembly environment
19.	Study On Tin Whisker Growth Behavior And Growth Mechanism Of Microbumps With Small Diameter In 3D Packaging
20.	Research On Single Event Effect Of 3D Packaging ICS Based On TSV Interposer
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