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1. Anisotropic Conductive Adhesive And Its Application On The Packaging Of Radio Frequency Identification Tags
2. Analysis Of Anisotropic Conductive Adhesive Interconnection Under Multi-factors Influence And Optimization For Its Performance
3. Research On High Power DC/Dc Modular Power Supply
4. The Improve Of Mathematic Model For Spray Caused By Jet From Flip Bucket And Study On Affecting Factor
5. Numerical And Experimental Study On The Hydraulic Characteristics Of Spillway
6. Research On Hydraulic Characteristics Of Flip Bucket With Tongue-type
7. Bumping Technology For MEMS Flip Chip Packaging
8. Flexible Bumping Technology And Applications In MEMS Flip Chip Packaging
9. The Design Of The Commutating Logic Circuit Without Circumfluence And The Digital Pulse Flip-flop
10. Study On Air Entrainment To Alleviate Cavitations And Energy Dissipation & Scour Protection Of The High Head Spillway
11. Study On Dynamic Parameters Of Industrial Flip-Flow Screen
12. Study On Energy Dissipation Of Spillway Tunnel Of Shuiniujia Hydropower Station
13. Study On The Hydraulics Characteristics Of Flow In Open Channel Bends
14. Study On Effects Of Embankment Pre-setting Height On Post-construction Settlement For Soil Foundation Of Highway
15. Design And Simulation Of Pre-bonding System Of Flip Chip Equipment For RFID Packaging
16. Influence Of Elastic Deck And Other Key Components On Dynamic Parameters Of Flip-flow Screen
17. The Research Of Load Flow Automatically Soft Flip And Characteristics Of Regulation Of VSC-HVDC System
18. Force/Position Control And Application Based On Voice Coil Motor
19. Simulation And Finite Element Analysis Of Raising Flip Mechanism
20. Thermosonic Flip Lighting Led Thermal Analysis
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