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Keyword [Interconnects]
Result: 1 - 20 | Page: 1 of 2
1.
Study On Preparation And Properties Of Alloy Interconnects For Intermediate Temperature SOFC
2.
Preparation And Characterization Of Key Materials For Intermediate Temperature Solid Oxide Fuel Cells By Novel Wet Chemistry Methods
3.
Surface Sputtered Modification And High Temperature Oxidation Behavior Of Low Cr Fe-Ni Base Alloy
4.
Chromium Deposition And Poisoning Between Metallic Interconnects And Cathode For Solid Oxide Fuel Cells
5.
Elements Diffusion And Optimization Design Of Protective Coatings For Sofc Metallic Interconnects
6.
Optimization Research Of MnCo Protective Coatings For Sofc Metallic Interconnects
7.
Thermo-mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (TSVs)
8.
Modeling rate dependent durability of low-ag sac interconnects for area array packages under torsion loads
9.
Processing and Properties of Metallic Foams for Solid-Oxide Fuel Cell Interconnects
10.
Statistical analysis for on-chip power grid networks and interconnects considering process variation
11.
Spinel coatings for solid oxide fuel cell interconnects and crystal structure of copper manganese oxide
12.
Harmonic and random vibration durability investigation for tin-silver-copper solder interconnects
13.
The effect of an imposed current on the creep of tin silver copper interconnects
14.
Probabilistic physics of failure assessment of thermomechanical fatigue in high-I/O area-array interconnects
15.
Interconnects for intermediate temperature solid oxide fuel cells
16.
Interfacial fracture of micro thin film interconnects under monotonic and cyclic loading
17.
Study of solid oxide fuel cell interconnects, protective coatings and advanced physical vapor deposition techniques
18.
Effect of dynamic flexural loading on the durability and failure site of solder interconnects of Printed Wiring Assemblies
19.
Design, fabrication and characterization of novel planar solid oxide fuel cells
20.
Multi-objective design optimization of beol / fbeol region during chip attachment to substrate
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