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Keyword [wafer]
Result: 181 - 200 | Page: 10 of 10
181. Modeling of chemical mechanical polishing at multiple scales
182. Design and characterization of central functionalized asymmetric tri-block copolymer modified surfaces
183. Low pressure chemical vapor deposited borosilicate glasses for materials integration applications
184. Properties of misfit dislocations in thick silicon epitaxy
185. The oxidation and removal of thin organic films from a wafer surface: Fundamentals of ozonated water application and water recycle
186. Visualization of colloidal particle dynamics at a solid-liquid interface
187. Modeling and simulation of a tungsten chemical vapor deposition reactor
188. Integration of gallium nitride thin films with dissimilar substrate materials by wafer bonding and laser lift-off
189. Slurry mean residence time analysis and pad-wafer contact characterization in chemical mechanical planarization
190. Investigating fluid behavior beneath a wafer during chemical mechanical polishing processes
191. Submicron particle adhesion and removal in chemical mechanical polishing and wafer cleaning processes
192. Oxide etching in inductively coupled fluorocarbon plasmas: Chemistry and reactor simulations
193. Aluminum gallium arsenide-indium gallium arsenide crystal growth, buried tunnel contact lasers, wafer bonding, and alluminum gallium arsenide oxide-based VCSELs
194. Temperature and process uniformity control in rapid thermal processing
195. Science and technology of plasma activated direct wafer bonding
196. Interface mechanics of chemical-mechanical polishing for integrated-circuit planarization
197. Aerosol jet cleaning of silicon wafers
198. Exposure assessment and risk management of engineered nanoparticles: Investigation in semiconductor wafer processing
199. Research On Influence Of Crystal Anisotropy On The Surface Shape Deviation Of Sliced Wafer By Diamond Wire Sawing
200. Research On Cutting Method Of Thermal Cracking Ceramics With Low Microwave Absorptivity And Silicon Wafer Using Surface Heat Source
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