soldering - Globe Thesis

Keyword [soldering] Result: 41 - 60 \| Page: 3 of 10
41.	Effect Of Solder Volume On Interfacial Reactions Between Lead-free Solder Balls And Different Pads
42.	On Welding Method And Separating Technical Of Discarded Cu-Al Welded Joints
43.	Research On Manufacture And Applications Of Ausn20 Solder Preform
44.	Study Of Sn-Zn Based Solders For Low-temperature Aluminum Soldering In Electronic Packaging
45.	Researh On Interface Structure And Mechanical Properties Of Joints Of Soldering Pure Al And Al-mn Alloy With Sn Based Solders
46.	Sn2.5Ag0.7Cu0.1RE/Cu Soldering Assisted With Ultrasonic Vibration And Electric Field And Its Aging Characteristics
47.	Design And Research Of The Flow Control System Of The Soldering Pen
48.	Study On The Soldering Process Of Fe-based Amorphous And Aluminum Assisted By Ultrasonic Vibrations
49.	Numerical Simulation And Experimental Study Of Temperature Rise In Ultrasonic Soldering
50.	Characteristics And Effects Of The Ultrasonic Cavitation In The Thin Layer Of Liquid Metal
51.	Mechanism Of Interfacial Formation And Progress Of Ultrasonic Aided Soldering Of Sapphire
52.	Study On Metallization And Densification Of Al₂O₃Ceramic Packaging Substrate For High-power LED
53.	Studying On Preparation And Properties Of Halogen-free,Rosin-free,Antibacterial And No-clean Flux For Lead-free Solder
54.	Preparation And Soldering Performance Of High Temperature Lead-Free Cu-Sn Solder Paste
55.	Optimization And Reliability Evaluation Of Lead-free Wave Soldering Process By DOE For Inverter Air-conditioner Motherboard
56.	Soldering Performance And Interfacial Reliability Between Lead-free Solder And Ni-based Composite Coating On Cu Substrate
57.	Study On Properties Of Sn-Zn-Ni And Sn-Zn-Bi-Al(Ni)Solders For Soldering Al And Cu
58.	Wetting Behavior Of Sn-9Zn Solder On Intermetallic Compounds Layer
59.	Study On Thermomigration In Cu/Sn-xZn/Cu Solder Joints During Soldering Reaction
60.	The Study Of Interfacial Cu₆Sn₅Growth Process And Influence Factors During Lead-free Soldering
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