microelectronics - Globe Thesis

Keyword [microelectronics] Result: 21 - 40 \| Page: 2 of 3
21.	The atomic layer deposition of noble metals for microelectronics applications
22.	Layer-by-layer nanoassembly combined with microfabrication techniques for microelectronics and microelectromechanical systems
23.	Silicon nanowires for advanced microelectronics: MBE gas-source growth and in situ devices
24.	Design and fabrication of lanthanum-doped tin-silver-copper lead-free solder for the next generation of microelectronics applications in severe environment
25.	Complex oxide thin films for microelectronics
26.	A systems approach to the reduction of thermal resistance in microelectronics packaging
27.	Mechanical behavior of microelectronics and power electronics solder joints under high current density: Analytical modeling and experimental investigation
28.	Chemistry of silicon-containing compounds and molecular approaches to materials for silicon-based microelectronics. Preparation of metal silyl complexes, studies of reactions between alkylidenes and silanes, and deposition of titanium oxide thin films
29.	Thermo-mechanical properties and integrity of metallic interconnects in microelectronics
30.	A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints
31.	Fabrication of metal matrix composite of copper and silicon for microelectronics packaging
32.	Inexpensive, high-resolution, high-temperature characterization of thermally induced strains: Applications to microelectronics and fuel cells
33.	Crosslinking of polynorbornene based dielectrics for application in microelectronics
34.	Energetic ion-based deposition and implantation of metal-nitride diffusion barriers for microelectronics applications by plasma source ion implantation
35.	Analysis of laser processing of metal wires used in microelectronics applications
36.	Organic materials for microelectronics: 157 nm photoresists and electrooptic liquid crystals
37.	Cure behavior of epoxy polymers used in microelectronics
38.	Isotropic copper-invar alloys for microelectronics packaging
39.	Synthesis and characterization of thermosetting polyimide oligomers for microelectronics packaging
40.	Selective laser sintering of aluminum nitride for microelectronics packaging
<<First <Prev Next> Last>> Jump to