Keyword [electroplated copper] Result: 1 - 13 | Page: 1 of 1 1.  Fatigue Characteristics And Life Prediction For MEMS Electroplated Copper Films 2.  Study On Fatigue Fracture Property And Life Prediction Of Notched Electroplated Copper Film 3.  Growth Control Of Full Compound Solder Joints In 3D Packages 4.  Study On The Mechanism And Application Of Acid Electroplated Copper Plating Additives For PCB 5.  Research On Levelers For Filling Electroplated Copper Microvias In Printed Circuit Board Industry 6.  Study On Microstructure Of Electroplated Copper Foil And And Shear Properties Of Solder Joints 7.  Study On Interfacial Structure Evolution And Shear Fracture Mechanism Of Sn-based Solder/Kovar Joints 8.  Study On Aluminum Alloy Surface Modification And Influence On The Performance Of Electroplated Copper 9.  Deformation mechanisms in nanoscale single crystalline electroplated copper pillars 10.  Microstructure study of electroplated copper films for ULSI metal interconnections 11.  Research And Application Of THs Electroplating Leveler For Printed Circuit Board 12.  Study On Synthesis And Properties Of A New Brightener For Electroplating Copper Pillars On HDI Printed Circuit Board 13.  Research On The Regulation Of Through-hole Interconnect Electrodeposition By Bifunctional Group Organic Additives   <<First  <Prev  Next>  Last>>  Jump to

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