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Keyword [Solder joints]
Result: 21 - 40 | Page: 2 of 10
21.
Analysis On SMT Lead-free Solder Joints Reliability Under Random Vibration Loading
22.
Study On Reliability Of SN63PB37, SN3.0AG0.5CU Solders And Solder Joints Under Low Temperature
23.
Study On Thermomigration In Cu/Sn-xZn/Cu Solder Joints During Soldering Reaction
24.
Failure Analysis Of Lead-free Solder Joints Under Temperature-vibration Coupling
25.
Thermal Reliability Of Low-silver Sn-Ag-Cu Lead-free Solder Joints
26.
Influence Of Argon Reflow On The Microstructure And Properties Of Lead-free Solder Joints
27.
Research On Creep Behavior Of The Miniature Lead-free Solder Joints Under The Condition Of Multi-field Coupling
28.
Reasearch On The Electromigration Behavior Of The Miniature Lead-free Solder Joint
29.
Sn-Based Solder Joints Property And Life Prediction In Extremely Low Temperature
30.
Effect Of Copper-Aluminum Intermetallics On The Reliability Of SnAgCu Solder Joints
31.
Optimization Of Flux For Sn-Cu Hypoeutectic Solder And Interfacial IMC In Solder Joints
32.
Grain Orientations And Anisotropic Properties Of Cu-Sn IMCs In Micro-Interconnection Solder Joints
33.
Research On The Electromigration Phenomena Of Lead-Free Solder And Intermetallic Cu
6
Sn
5
Phase In Lap Solder Joints
34.
Experiment Research On Low Vacuum Brazing Stainless Steel Oil Cooler With Pure Copper Solder
35.
The Influences Of Sn0.3Ag0.7Cu Lead-Free Solder Joints Interfacial Reaction On Reliability
36.
The Study On Growth Mechanism Of Kirkendall Void And Its Inhibition At Interface Of Micron Solder Joints
37.
Influence Of Nano-modifided Solder On Interfacial Reaction And Mechanical Property Of Lead-free Solder Joints
38.
Study On Properties Of SnAgCu Based Quintuple Alloy Solder Joints And Their IMC Evolution As Thermal Aging Condition
39.
Interface Diffusion And Electromigration Regularity Of Cu/SnAgCu/Cu Micro Solder Joints Under Electro-thermal Coupling
40.
Research On The Soldering Ability And Reliability Of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints
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