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Keyword [Solder joints]
Result: 21 - 40 | Page: 2 of 10
21. Analysis On SMT Lead-free Solder Joints Reliability Under Random Vibration Loading
22. Study On Reliability Of SN63PB37, SN3.0AG0.5CU Solders And Solder Joints Under Low Temperature
23. Study On Thermomigration In Cu/Sn-xZn/Cu Solder Joints During Soldering Reaction
24. Failure Analysis Of Lead-free Solder Joints Under Temperature-vibration Coupling
25. Thermal Reliability Of Low-silver Sn-Ag-Cu Lead-free Solder Joints
26. Influence Of Argon Reflow On The Microstructure And Properties Of Lead-free Solder Joints
27. Research On Creep Behavior Of The Miniature Lead-free Solder Joints Under The Condition Of Multi-field Coupling
28. Reasearch On The Electromigration Behavior Of The Miniature Lead-free Solder Joint
29. Sn-Based Solder Joints Property And Life Prediction In Extremely Low Temperature
30. Effect Of Copper-Aluminum Intermetallics On The Reliability Of SnAgCu Solder Joints
31. Optimization Of Flux For Sn-Cu Hypoeutectic Solder And Interfacial IMC In Solder Joints
32. Grain Orientations And Anisotropic Properties Of Cu-Sn IMCs In Micro-Interconnection Solder Joints
33. Research On The Electromigration Phenomena Of Lead-Free Solder And Intermetallic Cu6Sn5 Phase In Lap Solder Joints
34. Experiment Research On Low Vacuum Brazing Stainless Steel Oil Cooler With Pure Copper Solder
35. The Influences Of Sn0.3Ag0.7Cu Lead-Free Solder Joints Interfacial Reaction On Reliability
36. The Study On Growth Mechanism Of Kirkendall Void And Its Inhibition At Interface Of Micron Solder Joints
37. Influence Of Nano-modifided Solder On Interfacial Reaction And Mechanical Property Of Lead-free Solder Joints
38. Study On Properties Of SnAgCu Based Quintuple Alloy Solder Joints And Their IMC Evolution As Thermal Aging Condition
39. Interface Diffusion And Electromigration Regularity Of Cu/SnAgCu/Cu Micro Solder Joints Under Electro-thermal Coupling
40. Research On The Soldering Ability And Reliability Of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints
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