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Keyword [Sn63Pb37]
Result: 1 - 4 | Page: 1 of 1
1.
Creep Behavior Of Multilayer Structures And Creep Test On Tin-Lead Solder Under Mechanical Stress And Electric Current
2.
Study On Reliability Of SN63PB37, SN3.0AG0.5CU Solders And Solder Joints Under Low Temperature
3.
3D Simulation And Experiments Of Ultrasonic Soldering Of Copper /aluminum Alloy
4.
Microstructure And Properties Of CuCGA Solder Column Interconnection Under New Column Planting Method
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