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Keyword [Sn58Bi]
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1. Influence Of Zinc Addition On The Properties Of Sn58Bi Eutectic Solder Alloy
2. Study Of Modification And Mechanism Of Nano-particles On Sn58Bi/Cu Micro Solder Joints
3. Effect Of Ni On Interface Reaction And Joint Properties Of Sn58Bi Brazed Joint
4. Microstructure And Mechenical Properties Study Of Ni And Ni-coated Carbon Nanotubes Reinforced Sn58Bi Lead-free Solder
5. Theoretical Calculation On Cu6Sn5 Intermetallics And Experimental Investigation On Properties Of Sn58Bi-Cu6Sn5 Lead-free Solder
6. Design And Preparation Of Sn58Bi-xCu Solder And The Mechanism Of Influence On The Performance Of Micro Solder Joints
7. Study On The Properties Of Sn58Bi-GNSs Composite Lead-free Solder And Its Intermetallic Compound Ni3Sn4 Alloys
8. Research On The Microstructure And Properties Of Sn58Bi-X Lead-free Solder
9. Microstructure And Mechanical Properties Of Sn58Bi/Sn3.0Ag0.5Cu/Cu Solder Joints
10. Research On Microscale Mechanical Behavior And Coupled Thermo-electrical Analysis Of Sn58Bi Solder Alloy In Electronic Packaging
11. Study On Microscale Mechanical Behavior Of Electronic Packaging Sn58Bi Lead-free Solder Based On Nanoindentation Test And Finite Element Simulation
12. Study On Microstructure And Properties Of Sn-based Interconnect Solder In Three-dimensional Packaging
13. Study On The Properties Of Al2O3 Nanoparticles And Cr Reinforced Sn58Bi Lead-free Solder
14. Study On Microstructure And Mechanical Properties Of Sn58Bi/Cu Column Friction Welding Spot
15. Study On Modification And Mechanism Of Sn58Bi Low-Temperature Lead-Free Solder
16. Research On The Reliability Of Solder Joints Of Sn58Bi Composite Solder 3D Package Enhanced By BN Particles
17. Influence Of Microstructure Evolution On Electromigration Behavior Of Cu/Sn58Bi/Cu Microscale Solder Joints In Electronic Packaging
18. Microstructure Simulation And Mechanical Behavior Study Of Heterogeneous Anisotropic Microscale Cu/Sn58Bi/Cu Solder Joints In Electronic Packaging
19. Effect Of Cr Addition On Solder Joint Interface Reaction And Properties Of Sn58Bi New Lead-free Solder
20. Research On Mechanical And Electromigration Behavior Of Ni3Sn4 Particle Enhanced SnBi Lead-Free Solder
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