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Keyword [Sn grain]
Result: 1 - 3 | Page: 1 of 1
1.
Interaction Between Anisotropic Diffusivity In ?-Sn Grain And Electronmigration Behavior In Flip Chip Lead-free Solder Bumps
2.
Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints
3.
The effects of nucleation and solidification mechanisms on the microstructure and thermomechanical response of tin silver copper solder joints
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