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Keyword [Slurry formulations]
Result: 1 - 2 | Page: 1 of 1
1.
Investigation of novel alumina nanoabrasive and the interactions with basic chemical components in copper chemical mechanical planarization (CMP) slurries
2.
Novel slurry formulations and associated mechanisms for chemical mechanical polishing of polysilicon, silicon dioxide and silicon nitride films in microelectronic applications
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