Font Size:
a
A
A
Keyword [Metallizations]
Result: 1 - 5 | Page: 1 of 1
1.
Kinetics of intermetallic growth at the interfaces of soldered metallizations
2.
Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging
3.
Interfacial structures and electrical properties of titanium and germanium/nickel metallizations to indium phosphide (thin films)
4.
Wetting kinetics and interfacial reaction of lead-based and lead-free solder alloys on copper and nickel metallizations in electronic packaging
5.
Interfacial structures and electrical properties in palladium-based metallizations to n-type indium phosphide
<<First
<Prev Next>
Last>>
Jump to
