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Keyword [Low dielectric]
Result: 181 - 200 | Page: 10 of 10
181. Characterization and integration of silver metallization and low-dielectric-constant materials
182. Low temperature dielectric response of amorphous solids
183. A study of reactive ion etching of low dielectric constant polymers
184. Investigations of the low-dielectric-constant fluorinated polyimide for use as the interlayer dielectric in ULSI
185. Recombination of Charge Carriers in Low Dielectric Constant Organic Solvent
186. Synthesis Of Low Dielectric-loss And Discharge-Resistant Polyimide And The Regulation Mechanism Of High Frequency Insulation Properties
187. Barium Copper Silicate-Based Low-Permittivity Microwave Dielectric Ceramics And Their Application For LTCC
188. Synthesis And Properties Of A Novel Hyperbranched Polycarbosilane-siloxane Low Dielectric Resin
189. Photo/Thermally Cured Low Dielectric Silicon Resins Via Incorporating Silacyclobutane And Benzocyclobutene Groups
190. Investigation Of Intrinsic Dielectric Loss Mechanism Of Medium-low Dielectric Constant Materials With Rare Earth Cations
191. Design,Preparation And Performance Research Of Allyl-functionalized Epoxy Resin
192. Study On Controllable Crosslinking And Triboelectric Properties Of Poly (Arylene Ether) Containing Perfluorobiphenyl Structure
193. Preparation,structure And Properties Of High Strength And Low Dielectric Polyimide Fibers
194. Fabrication And Properties Of Polyimide Composite Aerogels
195. Synthesis And Properties Of Phenylacetylene-terminated Polyimide Resin With Low Dielectric Constant
196. Preparation And Properties Of Low-Dielectric Matrix Coatings By Plasma Spraying Technology
197. Research On Giant Dielectric Behavior And Dielectric Enhancement Mechanism Of CdCu3Ti4O12 Based Materials
198. Study On The Structure And Properties Of PE Based Composites Of Low Dielectric Constant With EVA As Modified Resin
199. Structure And Properties Of Low-Dielectric Composites Modified Based On Cage Polyhedral Oligomeric Silsesquioxanes
200. Preparation And Properties Of Polyhedral Oligomeric Silsesquioxane/Polyimide Porous Composite Films With Low Dieclectric Constant
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