Lead-free solder joints - Globe Thesis

Keyword [Lead-free solder joints] Result: 21 - 40 \| Page: 2 of 3
21.	Research On Electromigration Failure Of Lead-free Solder Joints Considering Grain Structure
22.	The Study Of Shear Mechanical Properties Of SAC-Re Lead-free BGA Solder Joints Under Board-level Structure
23.	The Effect Of Electroplating Parameters On Copper Foil And Interfacial Voids Of Lead-free Solder Joints
24.	Study On The Interface Structure And Shear Properties Of Ni(P)-Cu Nano-composite Coating On Lead-Free Solder Joints
25.	Electromigration and thermomigration reliability of lead-free solder joints for advanced packaging applications
26.	Microvoid formation and Kirkendall effect in lead-free solder joints
27.	Quantitative assessment of long term aging effects on the mechanical properties of lead free solder joints
28.	Synchrotron polychromatic X-ray Laue microdiffraction studies of electromigration in aluminum (copper) interconnects and lead-free solder joints
29.	Electromigration enhanced kinetics of copper-tin intermetallic compounds in lead-free solder joints and copper low-k dual damascene processing using step and flash imprint lithography
30.	The kinetics of tin solidification in lead-free solder joints
31.	Polarity effect of electromigration on mechanical properties of lead-free solder joints
32.	Grain structure evolution of tin-based lead-free solder joints in electronic packaging assembly and its impacts on the fatigue reliability
33.	Roles of service parameters on the mechanical behavior of lead-free solder joints
34.	Accelerated thermal fatigue of tin-lead and lead-free solder joints: Effect of temperature range and rate of change
35.	Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints
36.	Investigation into characteristics of thermal fatigue modeling of lead-free solder joints and optimization of temperature cycling profile
37.	The role of soldering process variables on properties of lead-free solder joints
38.	Stress relaxation in lead-free solder joints
39.	Characterization and Modeling of the Failure Mechanism of Copper-Tin (Cu-Sn) Intermetallic Compounds in Lead-free Solder Joints
40.	Effect Of CNT Surface Modification On Microstructure And Shear Properties Of Lead-free Solder Joints
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