Interconnect - Globe Thesis

Keyword [Interconnect] Result: 81 - 100 \| Page: 5 of 7
81.	Impact of Thermal Aging on Crack Growth Behavior of Lead Free Solder Interconnect
82.	Process evaluation and characterization of tungsten nitride as a diffusion barrier for copper interconnect technology
83.	Comparison of high power impulse magnetron sputtering and modulated pulsed power sputtering for interconnect metallization
84.	The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of copper/low-kappa interconnect structures
85.	Application of x-ray diffraction to microstructure assessment for microelectronic interconnect materials
86.	Chemical vapor deposition of thin films for ULSI interconnect metallization
87.	Fundamental investigation and development of lead-free nanosolders for nanowire assembly and nano-joining
88.	Interconnect-centric design issues in nanometer IC technology
89.	Graphene-based interconnects: Electrical performance and reliability
90.	X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures
91.	Modification of low dielectric constant materials for ULSI multilevel interconnection by ion implantation
92.	Fundamentals of area array solder interconnect yield
93.	Fundamentals of solder interconnect wetting
94.	Electrical interconnect of components transferred by fluidic microassembly using capillary forces
95.	Investigations of materials issues in advanced interconnect structures
96.	Electrochemical deposition of copper for gigascale interconnect technologies
97.	An experimental and finite element investigation of thermally induced inelastic deformation of single-level damascene copper high density interconnect structures
98.	Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects
99.	Critical properties and reliability of low-k dielectrics for ULSI interconnect applications: Thickness and temperature dependence
100.	Surface and interfacial chemistry of high-k dielectric and interconnect materials on silicon
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