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Keyword [Electronic packaging material]
Result: 1 - 15 | Page: 1 of 1
1. The Preparation And Property Research Of Epoxy Resin Based Electric Electronic Packaging Material
2. Study On The Preparation And Properties Of Electronic Packaging Material ZrW2O8/E-51 With Lower Linear Expansion Coefficient
3. Fabrication And Properties Of β-SiCp/Al Electronic Packaging Material By Pressureless Infiltration
4. Fabrication And Properties Of β-SiCp/Al Electronic Packaging Material By Powder- Metallurgy
5. The Laser Brazing Technology Study Of Aluminium Matrix Composites Reinforced With High Volume Fraction SiC Particles
6. Studies On The Preparation Of Cu/Invar Electronic Packaging Composites By Powder Metallurgy
7. Research On Preparation And Performance Of Short Graphite Fiber/Al Electronic Packaging Material
8. Rearch Of Green Environmental Protection Hemp Fiber Reinforced Thermosetting Resins Electronic Packaging Material
9. Studies On Electroless Ni Alloy Plating And Sodering Of The SiCp/Al Electronic Packaging Composites Of High SiC Content
10. Preparation And Interface Optimization Of Cu/Ag(Invar) Electronic Packaging Composites
11. Fabrication And Thermo-mechanical Properties Of SiCp/6061Al Electronic Packaging Material By Powder Metallurgy
12. Milling Amount Optimization Of High Silicon Aluminum Alloy Using For Electronic Packaging Material And Development Of Software System
13. Study On Preparation And Properties Of High Temperature Resistant Epoxy Resin-Based Electronic Packaging Material
14. Preparation Of High Heat-resistant Electronic Packaging Material Based On Bismaleimide Resin
15. Microstructure And Properties Of Al-50Si-0.5X (X=Sc,La,Nb) Alloy For Electronic Packaging
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