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Keyword [Electronic packages]
Result: 1 - 7 | Page: 1 of 1
1.
Materials science in pre-plated leadframes for electronic packages
2.
A multi-scale method for the prediction of delamination in electronic packages
3.
Characterization of non-linear polymer properties to predict process induced warpage and residual stress of electronic packages
4.
Analysis of heat dissipation in electronic packages using CVD diamond substrate
5.
A combined experimental and analytical approach for interface fracture parameters between dissimilar materials in electronic packages
6.
Thermomechanical properties of packaging materials and their applications to reliability evaluation for electronic packages
7.
Gallium arsenide die crack initiation in area array electronic packages
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