Direct current - Globe Thesis

Keyword [Direct current] Result: 141 - 160 \| Page: 8 of 9
141.	Preparation Of Semi-alicyclic Polyimides And Research On Their Alignment Behaviors For Liquid Crystal Molecules
142.	Wetting Behavior And Interfacial Reaction Of Fe/Sn System Under Assistance Of Ultrasonic Vibration And Current
143.	Research On The Detection Of Abnormal Stress In Front Of Driving Work Based On Dc Method
144.	Study On Lignin Wastewater Treatment By Direct Current Enhanced Activated Sludge Approach
145.	Simulation Of Additive Synergistic Effect In Direct Current Electroplating Of Through Silicon Via
146.	Study On Geoelectrical Response Characteristics Of Landfill Leakage
147.	Research On The Mechanism Of Direct Current Electric Field Increasing Two-phase Seepage
148.	Control of carbon nanotube growth directions and morphology by direct current plasma enhanced chemical vapor deposition
149.	Flow characteristics of a direct current stirring device
150.	Environmental mercury analysis using a direct current discharge emission type detector
151.	Mathematical modeling of a direct current glow discharge in argon
152.	Synthesis And Electrochemical Performances Of Si-based Nanocomposites Prepared By Arc-discharge Plasma
153.	Study On The Dissolution And Wetting Behavior Of Sn/Cu System With Ultrasonic And Direct Current
154.	Design And Experimental Research Of High Performance Output Triboelectric Nanogenerator
155.	Preparation Of Copper Nanowires Array And Their Micro-joints Applications
156.	Numerical Simulation Of Finite Element Forward Modeling Of Multi-point Current Source Mine With Direct Current Method For Advanced Detection
157.	Research On Monitoring Technology Of Water Inrush Process Of Concealed Structure Based On Polarization Parameter
158.	Effects Of Electric Current On Microstructures And Properties Of 7B04 Alloy During Aging Treatments
159.	Effects Of Electric Current On Microstructures And Properties Of 7b04 Alloy During Two-stage Aging And Regression Re-aging Treatments
160.	Interfacial Diffusion Behavior And Microstructure Evolution Of Cu/Sn/Cu Materials For Electronic Packaging Under Electric Field
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