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Keyword [Die attach]
Result: 1 - 10 | Page: 1 of 1
1.
Preparation Process And Properties Characterization Of High-Temerature Resistant Interconnection Material Based On Porous Cu Infiltrated With Sn-Based Solder
2.
Joining Process And Properties Characterization Of High-Temperature Resistant Bondlines Based On Porous Silver Infiltrated With Indium
3.
Die-attach Process Of Double-sided Cooling SiC MOSFET Modules
4.
Investigation of reactively structured aluminum/nickel multilayer foils and their applications in high temperature die attach
5.
Temperature- and rate-dependent partitioned constitutive relationships for 95.5 lead 2 tin 2.5 silver solder alloy
6.
Investigation On Sintering Process Optimization Of Nano-Copper Die Attach Composite
7.
Investigation On Preparation And Thermal-Mechanical-Electrical Properties Of Sintered Copper Matrix Die Attach Materials For Wide Bandgap Semiconductor Packaging
8.
Study On Nano Silver Die Attach Materials Prepared By Spark Ablation And Its Bonding Performancer
9.
Developing And Performance Research Of Die Attach Solder Paste For LED Flip Chip Based On SnAgCu Lead-free Solder
10.
Investigation On Thermal Performance Of Graphene Reinforced Die Attach Materials For Power Electronic Packaging
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