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Keyword [Cu6Sn5]
Result: 1 - 9 | Page: 1 of 1
1.
Study Of Morphological Evolution Of Cu
6
Sn
5
Formed In Reaction Between Sn3.5Ag Solder And Cu
2.
Preparation Of Cu
6
Sn
5
Nanoparticles And Exploration Of Joining Process Of Cu
6
Sn
5
3.
Grain Orientations And Anisotropic Properties Of Cu-Sn IMCs In Micro-Interconnection Solder Joints
4.
Investigations On Interfacial Microstructures And Mechanical Properties Of Sn-3.0Ag-0.5Cu Solder/Cu Joints
5.
Liquid-Solid Electromigration Behavior And Mechanism Of Micro Interconnect
6.
Effect Of Ce On Properties And Growth Behaviour Of Cu
6
Sn
5
Layer Of Sn-3.8Ag-0.7Cu
7.
Machenisms Of Low Temperature Sintering Cu
6
Sn
5
Nanoparticles And Manufaturing Of High Temperature Bearing Nanograin Interconnects
8.
Study On Electromigration Behavior And Mechanism Of Cu
6
Sn
5
Reinforced Sn-based Single-crystal Solder Joints
9.
Orientation distribution, morphology, and size distribution of copper-tin intermetallic compound in reactions between molten solder and copper in flip chip solder joints
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