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Keyword [Chemical-Mechanical Polishing]
Result: 141 - 160 | Page: 8 of 10
141.
Measurements of friction and wear in chemical mechanical polishing using single particle analog probes
142.
Chemical mechanical polishing of tantalum and tantalum nitride
143.
Kinetic study of copper chemistry in chemical mechanical polishing (CMP) by an in-situ real time measurement technique
144.
Chemical mechanical polishing and grinding of silicon wafers
145.
Interfacial forces in Chemical-Mechanical Polishing (CMP)
146.
Chemical-mechanical polishing of copper interconnects and dielectric films for microelectronic applications
147.
Chemical mechanical polishing of methyl silsesquioxane
148.
Chemical mechanical polishing of Indium phosphide, Gallium arsenide and Indium gallium arsenide films and related environment and safety aspects
149.
Chemical mechanical polishing of copper using nanoparticle-based slurries
150.
Shear thickening and defect formation in chemical mechanical polishing slurries
151.
Chemical Mechanical Polishing of Ruthenium and Several Dielectric Films
152.
Experimental and molecular dynamics studies in copper electro chemical mechanical polishing (Cu-ECMP)
153.
Particle scale modeling of material removal and surface roughness in chemical mechanical polishing
154.
Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper
155.
Measurement and modeling of fluid pressures in chemical mechanical polishing
156.
Modeling pad wear and pad conditioning in chemical-mechanical polishing using population balance model
157.
Characterization of the chemical effects of ceria slurries for dielectric chemical mechanical polishing
158.
Investigation of slurry systems in metal and dielectric chemical mechanical polishing
159.
Chemical-mechanical polishing of metal and dielectric films for microelectronic applications
160.
Macroscopic and microscopic modelling in chemical-mechanical polishing (CMP) process
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