Keyword [Chemical mechanical] Result: 181 - 200 | Page: 10 of 10 181.  Modeling and control of material removal and defectivity in chemical mechanical planarization 182.  Characterization and analysis on chemical and mechanical interactions during chemical mechanical planarization (CMP) of copper 183.  Copper surface chemistry relevant to chemical mechanical planarization (CMP) 184.  Kinetic study of copper chemistry in chemical mechanical polishing (CMP) by an in-situ real time measurement technique 185.  Fundamental consumables characterization of advanced dielectric and metal chemical mechanical planarization processes 186.  Application of the x-ray photoelectron spectroscopy for development of the niobium chemical mechanical process, photomodification of silicon for the field release mass spectrometer, and analysis of the multifunctional oxide heterostructures 187.  Chemical mechanical polishing and grinding of silicon wafers 188.  Interfacial forces in Chemical-Mechanical Polishing (CMP) 189.  Characterization and modeling of mainstream and alternative conditioning and polishing technologies in inter-layer dielectric and copper chemical mechanical planarization 190.  Chemical mechanical planarization of copper thin films 191.  Application of fine particles in chemical mechanical planarization and in phosphors 192.  Effect of slurry chemicals on chemical-mechanical planarization of copper 193.  Novel separation methods for removing nanoparticles and copper from chemical mechanical planarization wastes 194.  Chemical-mechanical polishing of copper interconnects and dielectric films for microelectronic applications 195.  Evaluation and modeling of alternative copper and inter-layer dielectric chemical mechanical planarization technologies 196.  Chemical mechanical polishing of methyl silsesquioxane 197.  Investigation of the chemical and electrochemical phenomena in the chemical mechanical planarization of copper 198.  Chemical mechanical polishing of Indium phosphide, Gallium arsenide and Indium gallium arsenide films and related environment and safety aspects 199.  Tribological, kinetic and thermal characteristics of copper chemical mechanical planarization 200.  Physicochemical Modeling of Copper Chemical Mechanical Planarization (CMP) Considering Synergies in Removal Materials   <<First  <Prev  Next>  Last>>  Jump to

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