Interconnect - Globe Thesis

Keyword [Interconnect] Result: 21 - 40 \| Page: 2 of 2
21.	Development of a floating random-walk algorithm for solving Maxwell's equations in complex IC-interconnect structures
22.	Modeling crack growth by level sets
23.	A nested finite element methodology for virtual qualification of area-array microelectronic interconnect assemblies
24.	Research On Silicon-based Integrated Subwavelength Mode Division Multiplexing Photonic Devices And Their Inverse Design
25.	Research Of Testing Method For Interconnect Resources In FPGAs Based On Directed Graph Theory
26.	Research On Preparation And Reliability Of Nanotwinned Copper Interconnect Materials For Microelectronic Packaging
27.	Study On Interconnect Technology And Reliability Of Optical Fiber Connectors
28.	Numerical Simulation Of Reliability Of 2.5D/3D Package Interconnect Structure Under Temperature Cyclic Load
29.	Design And Fabrication Of 3D Optical Polymer Waveguides For Optical Interconnect And Optical Sensing Applications
30.	Research On Novel Vertical Grating Coupler For VCSEL-based On-chip Optical Interconnect
31.	Research On Signal Integrity Of Non-contact Laser Precision Soldering Interconnect
32.	Research Of On-chip Integrated Photonic Devices Based On Functional Polymer Waveguide Materials
33.	Interfacial Reaction And Reliability Of Micro Scale Solder Interconnects With (111)-oriented Nanotwinned Cu
34.	Research On Silicon-Based Optical Waveguide Microring Resonator And Traveling Wave-Like FP Resonator Devices And Their Applications
35.	Fault-hamiltonianity Of The Cartesian Product Graphs Of Paths And Cycles
36.	Research On The Rate-dependent Mechanical Properties Of Electronic Interconnected Conductive Adhesive And The Drop Impact Behavior Of Adhesive Interconnect Structure
37.	Reliability Analysis And Optimization Of TSV Interconnection Structure Under Combined Loading
38.	Research On Polymer Optical Waveguide Devices For On-board Optical Interconnects
39.	Mechanical Simulation Of CIS Interconnect Structure Under Temperature Cycling Conditions
40.	Study On The Electrothermal-mechanical Coupling Of Microwave Passive Structures Using Time-domain Differential Metho
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