Electronic Packaging - Globe Thesis

Font Size: a A A

Keyword [Electronic Packaging] Result: 1 - 9 \| Page: 1 of 1
1.	Studies On A Multifunctional Macro/Micro Moire Interferometer Measurement System And Its Applications
2.	High Temperature Moire Interferometry Technique And Its Applications
3.	Study On Damage-Coupled Time-Dependent Multiaxial Constitutive And Fatigue Failure Model Of Electronic Packaging Solder Alloy
4.	Elasto-Plastic Analysis Of Popcorn Failure Caused By Cavitition Unstable Growth In Plastic IC Packaging Material
5.	Research On The Thermal Deformation And Stress Of Metal Package With Low Resistance Leads
6.	Fatigue Damage Of The Electronic Packaging Under Random Vibrations
7.	Study On Bulge Test Instrument And Method For Mechanical Properties Of Electronic Packaging Materials
8.	Three-dimensional hybrid method using optical interferometry and nonlinear FEM for electronic packaging applications
9.	Solder Material And Size Effect On Fracture Properties Of Interconnects In Electronic Packaging
<<First <Prev Next> Last>> Jump to