Integrated circuit chip technology has already entered our daily lives, become anindispensable component of modern science and technology. In the paper, we focus ona semiconductor plasma dry etching RF control system. According to the designrequirements, the system is described. After that, the relationship among the system,the machine and the production is established. The RF control system includingplasma etching principle, RF processing principle and devices related to the RFsystem is analyzed. The experiment specifies on influence of the adjustment of the RFsystem on the dry etch processes, such as etching rate, uniformity, and the optimalproduction performance index is achieved through modulating the radio frequencymachine setting parameters. The productivity efficient is increased, the maintainingcost is cut down and the controlment over wafer cost is realized. |