Investigations On The Properties Of LTCC

With the extremely wide application of electronic technology in automation,industrial control, medical science, aerospace, daily life and other fields, thecharacteristics, such as high density, wide-temperature range, small size, versatility,high quality and so on, have become an inevitable trend of its development.Meanwhile, these characteristics have brought enormous challenges to the traditionalpackaging technique and process present. Among the numerous package technologies,Low temperature co-fired ceramic （LTCC） technology has became the focus ofinternational research, for the fact that products with the usage of LTCC technologycan have not only high current density, small volume, but also high reliability,excellent electrical properties, transmission characteristics and tightness.LTCC technology is an advanced hybrid IC packaging technology. It integratesthe four passive components, namely transformers （T）, capacitor （C）, inductor （L） andresistor（R）, and figures them in multilayer wiring substrates, then combines with activedevices （such as power MOS, transistors, IC circuit module etc） into a complete circuitsystem. So LTCC technology is also known as hybrid integration technology, whichcan effectively improve the circuit package density and system reliability.In this dissertation the composition and preparation process of microcrystallineglass system CaO-B₂O₃-SiO2（CBS） has been studied. At the same time therelationships among the composition, preparation process and properties ofCBS/Al₂O₃glass ceramic have been given. This paper also discusses the influence ofAl₂O₃additives on the electrical and thermal properties of CBS/Al₂O₃glass ceramic,including the dielectric constant, dielectric loss, thermal expansion coefficient andthermal diffusion coefficient. Finally, this paper presents the influence of the additivecontent of Bi₂O₃and quartz sand on the electrical and thermal properties of glassceramics.