The Research Of LTCC Glass Additives And Tape-casting Process

The basic principle of Low Temperature Co-fired Ceramic(LTCC) technology is to combine multi-layer ceramic element and multi-layer circuit graphics technology, then to set a lot of metal materials and passive components in ceramic with the sintering at below 1000℃. Which is a ceramic manufacturing technology.Paper at first introduces the characteristics, status, development trends of LTCC, and describes the sintering temperature, density, crystallization, dielectric constant, dielectric loss, thermal expansion and other performance requirements. The second, it introduces components of the glass additives and the sintering process. The third, it studies the formula of tape-casting and the process of crafts. It determines the best pulp and the two ball-milling times which meet the requirements, through the four main tape-casting materials experimental analysis of the solvent, dispersant, binder and thickener material. At last, it analyses the data of the softening temperature, sintering temperature, density, the main phase precipitation, dielectric constant, dielectric loss, and expansion coefficient calculated by the theoretical empirical formula, and then finds the laws.By CBS(CaO-B2O3-SiO2) system glass, with the innovation of introducing a new additive—Bi₂O₃ to the glass material, combined with differential thermal analysis, XRD, dielectric constant and other testing data, it studies the influences of Bi₂O₃ in the glass density, the main phase precipitation, the electrical and thermal performance , then summarizes the law of performance parameters by the increased content of Bi₂O₃.Furthermore, it studies the solvent, dispersant, binder, thickener and the casting technology. Then a good performance of LTCC material composition and sintering process have been designed, sintering temperature is 830℃, density is 3.0g/cm3, shrinkage rate is 17.6%, dielectric constant is less than 9.7 and dielectric loss tangent is less than 0.0057 at 1KHz, dielectric constant is less than 7.3 and dielectric loss tangent is less than 0.0049 at 10GHz.