Investigations On Microwave Characteristics Of Gold Wire Bonding And Via Interconnects Based On LTCC Technology

In this paper, the microwave characteristics of gold wire bonding interconnects andvia interconnects in multilayer circuit are discussed. Based on the analysis ofmicrowave transmission line, a model is established for gold wire bonding interconnectby the software of HFSS and ADS, to carry out a simulation to analyze the influence ofthe number of gold wire, diameter, high arch, span and other parameters on themicrowave characteristics of gold wire bonding interconnection. A matching design ofthe gold wire bonding interconnect in the millimeter wave band is studied by impedancematching techniques. And the match design of the gold wire is done and has beenoptimized in HFSS with the application of the smith chat. The return loss is about-60dBand-45dB, the bandwidth is20%and10%in the30GHz and60GHz separately, in thesimulation results, which shows that the microwave transmission characteristic is good.Then the microwave characteristics of the vertical transition of microstrip line-stripline-microstrip line, coplanar waveguide-stripline-coplanar waveguide, microstrip line-stripline, coplanar waveguide-stripline are studied. By adding grounding vias properlyin multilayer media and building models to analyze and optimize in HFSS, the returnloss of microstrip line-stripline is less than-10dB in1-40GHz band, which means thatthe transmission performance of the vertical transition is effectively improved. Theresults of HFSS simulation shows that the return loss has reached below-30dB at thecenter frequency of10GHz by using smith chat to carry on a matching design for theoptimized structure of microstrip lines–stripline. So the microwave transmissionperformance is excellent.