Preparation And Application Of The Environmental Wood Adhesive Based On Soybean

Firstly emulsified epoxy resin was used to modify formaldehyde-free soybean adhesive, the orthogonal experiment L9(34) was carried out to research the influence of the adhesive performance by the amount of epoxy resin, modified mixing alkali solution,20%SDS solution and reaction temperature, the best technology condition was:epoxy resin with5g, modified mixing alkali solution with3g,20%SDS solution with4g, reaction temperature with35℃. The orthogonal experiment L9(34) was carried out to research the influence of the adhesive performance by hot pressing temperature, pressure, time, the amount of glue spread, the best hot-pressing technology was that hot pressing temperature was130℃, hot pressing pressure was2.7MPa, hot pressing time was120s/mm, glue spread was445g/m2.Then epoxy resin which diluted by inert diluent was used to modify formaldehyde-free soybean adhesive, the single factor test was carried out to research the influence of the adhesive performance by the amount of epoxy resin, ethanol, modified mixing alkali solution, and reaction temperature, the best technology condition was made. The single factor test was carried out to research the influence of the adhesive performance by hot pressing temperature, the best hot-pressing temperature was150℃.Finally epoxy resin which diluted by reactive diluent was used to modify formaldehyde-free soybean adhesive, the orthogonal experiment L9(34) was carried out to research the influence of the adhesive performance by the amount of epoxy resin, modified mixing alkali solution, soybean meal and reaction temperature, the best technology condition was:epoxy resin with6g, modified mixing alkali solution with4.5g, soybean meal with17g, reaction temperature with50℃. The orthogonal experiment L9(34) was carried out to research the influence of the adhesive performance by hot pressing temperature, pressure, time, the amount of glue spread, the best hot-pressing technology was hot pressing temperature with150℃, hot pressing pressure with2.7MPa, hot pressing time with165s/mm, glue spread with625g/m2. FTIR showed modified epoxy reacts with formaldehyde-free soybean adhesive and the reaction at150℃is more thoroughly than130℃, epoxy resin can improve the water resistances of soybean adhesive.