Study Of Paste To Pack Machine Simulation Based On OpenGL

To meet electronic equipment the overall much kind of unit board level circuit modular, change the rapid requirement of batch, short period, low cost, high quality, miniaturization as well as upgrading, SMT(Surface Mounted Technology) surface pastes to pack production line has been already extensively applied. The combination of SMT and fictitious production is helpful for promotion PCB(Printed Circuit Board) board level circuit modular to design level and correct to guide the processing of PCB board level circuit modular, realizes fast production really, so it forms live research hot point.This paper is developing the foundation of the analysis of present situation for virtual manufacturing research as well as PCB board level circuit modular virtual manufacturing, is crucial in its SMT production line , the most complex NC (Numerical Control) equipment — paste to pack machine paste to pack emulate to study . It suggests that a kind of virtual realistic emulation environment based on OpenGL has carried out overall design. In this environment with one machine is example have discussed static quiet in detail paste the course of establishing of packing site scene. According to the specialty of the OpenGL and 3ds max, it pastes the course of packing, and have gone on emulation. Aim to the problem of the optimum path, change into the problem of TSP (Traveling Salesman Problem) and based on GASA algorithm to fulfill the course of optimum packing, and give trial to prove.Practice proof ripens fairly based on the OpenGL emulation environmental research of that has this paper to establish one, PCB board level circuit modular virtual manufacturing system in unit production aspect have established foundation.