The Analysis And Research Of Transfer Molding Technology In Micro-electronics Plastics Packages

With the fast development of electronics industry in recent years, the micro-electronics package, which is a link for the integrated circuit (IC) manufacturing industry, has already been developed into a very important package industry with large development foreground. Especially the plastics packages of micro-electronics, it has the character of lowly cost, simple craft as well as large-scale and roboticized production. Although the plastics packages doesn't belong to airtight seal, which has a lack of the heat-proof, heat-spreading and sealing compared with airtight seal, with the gradual improvement of package material and the continuous development of new craft technology and mold, the reliability of plastics packages has been improved greatly. Nowadays, plastics packages has been the mainstream of all kinds of packages in the consumption field of general public electronics products.Thereby, in the paper the transfer modeling mechanism, craft process and control of resin material which are made in plastics packages of micro-electronics, the mold of the plastics packages, as well as its relative encapsulation equipments are detailedly analyzed and researched. Combined the encapsulation material and craft scheme with the mold design provided a reasonable consult gist to the design and manufacture of plastics packages mold of micro-electronics.