Digital IC Failure Analyses Technology And Procedure

Reliability physics is also gone by the name of failure physics, technology of failure analysis is extremely important for reliability of digital IC. Failure analysis is more difficult, advanced equipment and rational methods of failure analysis are needed because of the development of integration. EDX, SEM, SAM and Light-emission were performed to inspect and study many cases for explaining these methods in this article.SAM is indispensable technology for IC package analysis. Lossless and convenient scan are advantaged to discover delamination, voids and cracks of package. It is necessary for deciding following failure analysis flow.According wafer processing, corresponding etching recipe and flow should be instituted. Recipe of chemical etch solution for deprocessing HC08 IC is studied and summarized. With correct etching time and flow, completely etch the layer you wanted and slightly loss of the nether layers are turned into reality.Testing fail samples with mini-tester under all test mode is an absolutely necessary step in the whole failure analysis flow. Detailed failure information to all modules is obtained before physical analysis. Consulting layout and schematic circuit chart, failure mode and mechanism could be presumed. These failure mode and mechanism would be confirmed in the following steps.Each module of IC has its function, they are separate and independent each other. This article contains the function, structure and test mode of CPU, ATD, RAM, and ROM module and so on. Large numbers of typical case are enumerated to illuminate failure analysis method of every module.