The Study Of Heat Transfer In Sealed Electronic Instrument Enclosure & The Design Of Temperature Control System

In view of the rapid increase in the miniaturization, lightweight of intelligent instrument. Increased heat fluxes pose a major cooling challenge in electronic instrument enclosure. Amount of heat accumulation directly influences the reliability of the instrument. To meet the challenge significant cooling technology enhancements will be needed.This article firstly analyzes and compares different kinds of heat transfer technologies of present applications in sealed electronic instrument. Considering special requirement of electronic enclosures in nautical and aeronautic application areas. Peltier cooling technology mixed up with cold plate technology is presented. Also, 1-wire digital thermometer as temperature probe, a microprocessor based fuzzy temperature control system is designed. The system adopts Pulse Width Modulation (PWM) as power control method. Experimental results indicate that the special heat dissipation needs of sealed instrument are satisfied. Furthermore interference-free feature and measurement control performance have been enhanced by using digital temperature sensor together with fuzzy control theory. In conclusion, the system poses advantages of no noise, high reliability and long life.